Current position：Home > Products > Supporting facilities
|
|
Direct bonding SiC | Compact SiC |
| W(F.C)% | ≤1 | ≤1 |
| W(Fe2O3 | ≤0.2 | ≤0.2 |
| Pressure resisting(mpa) | ≥229 | ≥300 |
| Bending strength(mpa) | ≥50 | ≥60 |
| 1400℃ bending strength(mpa) | ≥60 | ≥70 |
| Bulk density(g/cm3) | ≥2.71 | ≥3.4 |
| Apparent porosity(%) | ≤15 | ≤1.5 |
| 1000℃ thermal conductive | ≥27 | ≥45 |
